DocumentCode :
3223983
Title :
Cycle time metrics for R&D semiconductor wafer fabrication
Author :
Pierce, Neal G. ; Yost, Alan
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
fYear :
1995
fDate :
13-15 Nov 1995
Firstpage :
105
Lastpage :
110
Abstract :
This paper presents a case study for the successful development and effective use of cycle time metrics for fabricating semiconductor wafers in a research and development (R&D) environment. The metrics include multiples of theoretical cycle time (MTCT), breakdown analysis of cycle time, and cumulative queue times of baseline processes. Each of these metrics was applied to equipment types, process recipes, and overall pilot line performance as well as to production areas such as Films, Implant, and Etch.
Keywords :
research and development management; semiconductor device manufacture; R&D semiconductor wafer fabrication; baseline processes; breakdown analysis; cumulative queue times; cycle time metrics; equipment types; etch; films; implant; multiples of theoretical cycle time; pilot line; process recipes; production; research and development; Electric breakdown; Etching; Fabrication; Implants; Job shop scheduling; Laboratories; Manufacturing processes; Queueing analysis; Research and development; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
ISSN :
1078-8743
Print_ISBN :
0-7803-2713-6
Type :
conf
DOI :
10.1109/ASMC.1995.484350
Filename :
484350
Link To Document :
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