Title :
Stress effects on self-aligned silicon nanowires junctionless field effect transistors
Author :
Huang, C.J. ; Lee, S.C.
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The heavily doped n-type silicon nanowires (SiNWs) junctionless field effect transistors (JLFETs) are fabricated using the self-aligned process to control the position and direction of SiNWs. Aligned SiNWs are grown across the pre-patterned source and drain under the assistance of the externally applied electric field, which facilitate the subsequent device fabrication. The JLFET exhibits an electron mobility ~ 90 cm2/Vsec, on/off ratio ~ 107, and subthreshold slope ~ 100 mV/dec. Furthermore, the current variation under stress is investigated. It is shown that stress-induced current change reaches maximum when the JLFET is operated in pinch-off condition. Finally, improvement of off current by 98% and subthreshold swing by 15% using compressive stress of 100MPa in the n-type JLFET is achieved.
Keywords :
electron mobility; elemental semiconductors; field effect transistors; nanowires; semiconductor device manufacture; silicon; Si; electric field; electron mobility; heavily doped n-type nanowires; pressure 100 MPa; self-aligned nanowires junctionless field effect transistors; stress effects; Doping; Logic gates; MOSFET circuits; Nanowires; Piezoresistance; Silicon; Stress; junctionless field effect transistor (JLFET); self-aligned process; silicon nanowires; strained silicon;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4577-1514-3
Electronic_ISBN :
1944-9399
DOI :
10.1109/NANO.2011.6144312