Title :
Thermal shock and thermal NF3 in-situ furnace cleaning
Author :
Metteer, Brian L.
Author_Institution :
SEMATECH, Austin, TX, USA
Abstract :
Initial results from SEMATECH and SEMATECH sponsored research indicate great promise for successful commercial thermal shock and thermal NF3 in-situ cleaning of furnace process chambers. Use of the technologies on standard diffusion furnaces is highly flexible depending on a production facility´s current capacity and process conditions. Research at SEMATECH aimed at optimizing both methodologies will continue into 1996 with all data being completely accessible to SEMATECH member companies.
Keywords :
chemical vapour deposition; furnaces; integrated circuit manufacture; nitrogen compounds; surface cleaning; thermal shock; IC fabrication; NF3; SEMATECH; diffusion furnaces; furnace process chambers; hot-wall LPCVD furnaces; in-situ furnace cleaning; thermal NF3 cleaning; thermal shock; Cleaning; Costs; Electric shock; Furnaces; Gases; Instruments; Manufacturing; Production; Space technology; Strips;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
Print_ISBN :
0-7803-2713-6
DOI :
10.1109/ASMC.1995.484378
