• DocumentCode
    3224658
  • Title

    Defect sampling methodology: the development of an effective defect sampling strategy during the initial start-up phase of a 0.35 μm fabrication facility

  • Author

    Cappel, Robert ; Hilton, Rich ; Lim, Jason

  • Author_Institution
    Digital Semicond., Hudson, MA, USA
  • fYear
    1995
  • fDate
    13-15 Nov 1995
  • Firstpage
    271
  • Abstract
    Summary form only given, as follows. This paper details the path taken to develop a sampling strategy for monitoring defects within an advanced fabrication facility. The objective of this program is to develop a sampling plan that will provide for efficient process monitoring and effective yield prediction. The sampling plan will incorporate a strategy for the percentage of lots, the number of wafers within each lot and the diagnostic model formulated by researchers at Carnegie Mellon University and the University of California at Berkeley, data collected during the start-up phase of the fabrication process will be used in conjunction with factors such as equipment capacity, cost-of-ownership details and minimization of cycle time contributions by inspections to develop an inspection strategy that will allow for a quick progression from process development to a higher yielding manufacturing process.
  • Keywords
    inspection; integrated circuit yield; monitoring; 0.35 micron; 0.35 micron fabrication facility; IC yield; advanced fabrication facility; cost-of-ownership; defect sampling strategy; diagnostic model; equipment capacity; initial start-up phase; inspection strategy; manufacturing process; process monitoring; yield prediction; Capacity planning; Fabrication; Inspection; Instruments; Manufacturing processes; Monitoring; Sampling methods; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-2713-6
  • Type

    conf

  • DOI
    10.1109/ASMC.1995.484384
  • Filename
    484384