• DocumentCode
    3225201
  • Title

    Experiences with SMIF-integration for semiconductor fabrication

  • Author

    Klumpp, Bernhard ; Schliesser, Jochen ; Herzog, Olaf ; Staudt-Fischbach, Peter

  • Author_Institution
    Fraunhofer Soc., Inst. of Manuf. Eng. & Autom., Stuggart, Germany
  • fYear
    1995
  • fDate
    13-15 Nov 1995
  • Firstpage
    375
  • Lastpage
    379
  • Abstract
    SMIF technology for microelectronic production lines is being increasingly used worldwide. A crucial factor for an economical SMIF solution is the planning phase, where experience has shown that the general approach to the project must aim for an integrated solution. It is necessary to pursue the integrated concept right from the beginning of the planning phase in order to achieve a high reliability from a production line with SMIF automation. The main requirement of the philosophy is to provide process tools with integrated SMIF solutions. For the success of the project, process tools including SMIF and minienvironment components must be purchased. The main priority of a SMIF project is to discuss with tool vendors and SMIF/Minienvironment OEM vendors before purchasing the process equipment. This paper describes from experience the procedures, interfaces and requirements necessary to realize a SMIF manufacturing line with a high number of integrated SMIF process tool solutions.
  • Keywords
    computer integrated manufacturing; semiconductor device manufacture; OEM vendors; SMIF integration; automation; equipment purchasing; microelectronic production line; minienvironment components; planning; process tools; semiconductor fabrication; CMOS process; Computer integrated manufacturing; Fabrication; Manufacturing automation; Mechanical engineering; Optimized production technology; Paper technology; Particle measurements; Semiconductor device manufacture; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-2713-6
  • Type

    conf

  • DOI
    10.1109/ASMC.1995.484409
  • Filename
    484409