DocumentCode
3225772
Title
Impedance balance control for suppression of fluctuation on ground voltage in LSI package
Author
Maeda, Munenori ; Matsushima, Takaaki ; Wada, O.
Author_Institution
Dept. of Electr. Eng., Kyoto Univ., Katsura, Japan
fYear
2013
fDate
15-18 Dec. 2013
Firstpage
134
Lastpage
137
Abstract
Simultaneous switching current of a CMOS circuit causes power and ground bounces. The voltage fluctuation is injected into the CMOS substrate, and it degrades the performance of the circuit operation. In this report, we focus on the fact that parasitic couplings in the CMOS substrate and parasitic inductance in the power and ground connection form a bridge circuit, and we demonstrate that the voltage bounce can be suppressed by controlling variable resistances that are inserted between the substrate resistive coupling and the conductor line for the DC supply. The effectiveness of this method is verified with a scaled quad flat package (QFP) and we reduced the measured voltage bounce about 40 dBμV.
Keywords
CMOS integrated circuits; integrated circuit packaging; large scale integration; CMOS substrate; DC supply; LSI package; QFP; bridge circuit; circuit operation; conductor line; fluctuation suppression; ground connection; ground voltage; impedance balance control; parasitic couplings; parasitic inductance; power connection; scaled quad Àat package; substrate resistive coupling; switching current; variable resistances control; voltage bounce; CMOS integrated circuits; Couplings; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Noise; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013 9th Intl Workshop on
Conference_Location
Nara
Type
conf
DOI
10.1109/EMCCompo.2013.6735187
Filename
6735187
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