• DocumentCode
    3225981
  • Title

    Anti-resonance peak frequency control by variable on-die capacitance

  • Author

    Ichimura, Wataru ; Kiyoshige, Sho ; Terasaki, Masahiro ; Kobayashi, Ryota ; Kubo, Genki ; Otsuka, Hiroyuki ; Sudo, Toshio

  • Author_Institution
    Shibaura Inst. of Technol., Tokyo, Japan
  • fYear
    2013
  • fDate
    15-18 Dec. 2013
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    Power integrity design has been becoming important in the advanced CMOS digital systems, because power supply noise induces logic instability and electromagnetic radiation. Especially, anti-resonance peaks in power distribution network (PDN) due to the chip-package interaction induce the unwanted power supply fluctuation, and result in large electromagnetic radiation. In this paper, power supply noises and total impedances of power distribution network (PDN) for the variable structure of on-die capacitances have been examined. In addition, power supply noise and total PDN impedance have been examined by changing the number of power supply terminals. As a result, it has been proved that anti-resonance peaks could be controlled by on-die capacitance and the number of power supply terminals. Simulated anti-resonance peak frequencies were well correlated with the peak frequency spectra of measured power supply noise.
  • Keywords
    capacitance; chip-on-board packaging; electric impedance; electric noise measurement; CMOS digital systems; anti-resonance peak frequency control; chip-package interaction; electromagnetic radiation; logic instability; power distribution network; power integrity design; power supply noise; power supply terminals; total PDN impedance; unwanted power supply fluctuation; variable on-die capacitance; Capacitance; Electromagnetic compatibility; Frequency measurement; Impedance; Monitoring; Noise; Power supplies; Anti-resonance peaks; Co-design; Power integrity; Power supply noises;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013 9th Intl Workshop on
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/EMCCompo.2013.6735195
  • Filename
    6735195