Title :
Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission
Author :
Boyer, A. ; Ben Dhia, S.
Author_Institution :
INSA, Univ. de Toulouse; UPS, Toulouse, France
Abstract :
Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.
Keywords :
CMOS digital integrated circuits; integrated circuit modelling; microprocessor chips; power supply circuits; CMOS technology; ICEM modeling; conducted emission; digital integrated circuits; electrical stresses; electromagnetic emission; integrated circuit aging; on-chip measurements; power integrity; power supply voltage; size 90 nm; Degradation; Integrated circuit modeling; Power supplies; Stress; Stress measurement; Voltage measurement; ICEM modelling; Integrated circuits; accelerated aging; conducted emission; power integrity;
Conference_Titel :
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013 9th Intl Workshop on
Conference_Location :
Nara
DOI :
10.1109/EMCCompo.2013.6735199
