DocumentCode :
3226178
Title :
Mixed-level modeling for network on chip infrastructure in SoC design
Author :
Hu, Yang ; Yin, Shouyi ; Liu, Leibo ; Wei, Shaojun
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear :
2010
fDate :
6-9 Dec. 2010
Firstpage :
911
Lastpage :
914
Abstract :
We present a concise, fast, accurate, efficient mixed-level full-system based realistic application-oriented simulation platform in this paper which aims to evaluate the cycle-accurate behavior of interconnection component thus help developers to explore more optimized NoC architecture. A trace-driven transaction-level simulation environment is built to get realistic traffic patterns for interconnection. We design wrappers to translate the transaction-level traffic patterns into cycle-accurate flits. We implement routers at cycle-accurate level which use fixed five-step pipeline architectures pursuing more details in design, while implement peripherals (IP cores) at transaction-level following TLM 2.0 standard. Due to we only need to focus on the performance of interested part, that is the interconnection, under the premise of keeping the accuracy of interconnection simulation, the utilization of transaction-level models makes the peripheral modeling in full-system simulation environment more efficient, lightweight, configurable and scalable.
Keywords :
circuit simulation; multiprocessor interconnection networks; network routing; network-on-chip; pipeline processing; NoC architecture; SoC design; TLM 2.0 standard; cycle-accurate flits; fixed five-step pipeline architecture; interconnection component behavior; interconnection traffic pattern; mixed-level full-system based realistic application-oriented simulation; mixed-level modeling; network-on-chip; router implemention; trace-driven transaction-level simulation; transaction-level traffic pattern; Adaptation model; Engines; Payloads; Routing; Sockets; System-on-a-chip; Traffic control; Mixed-level modeling; NoC; TLM;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-7454-7
Type :
conf
DOI :
10.1109/APCCAS.2010.5774752
Filename :
5774752
Link To Document :
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