DocumentCode
3226194
Title
Application of fluorine doped SiO2 films for temperature compensated SAW devices
Author
Matsuda, S. ; Hara, M. ; Miura, M. ; Matsuda, T. ; Ueda, M. ; Satoh, Y. ; Hashimoto, K.
fYear
2011
fDate
18-21 Oct. 2011
Firstpage
76
Lastpage
78
Abstract
In our paper, we investigates acoustic properties including temperature coefficient of elasticity (TCE) of fluorine doped silicon oxide (SiOF) films and proposes their application to the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. From the Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. Then we fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO3-substrate structure, and their device performances were evaluated. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO2-based films even when the dopant is added. In comparison with the pure SiO2 with the film thickness h of 0.3 wavelengths (λ), TCF was improved by 7.7 ppm/°C without deterioration of the effective electromechanical coupling factor K2 when r=3.8 atomic % and h=0.28λ. The F inclusion did not influence the resonator Q factors obviously when r8.8 atomic%.
Keywords
Fourier transform spectra; elasticity; fluorine; infrared spectra; silicon compounds; surface acoustic wave filters; thin film devices; thin films; FT-IR spectroscopy; Fourier transform infrared spectroscopy; SAW devices; Si-O-Si atomic structure; SiO2:F; SiOF-overlay-Cu-grating-LiNbO3-substrate structure; acoustic properties; elasticity temperature coefficient; electromechanical coupling; fluorine doped silicon oxide films; radio frequency surface acoustic wave devices; temperature compensation; Atomic measurements; Films; Surface acoustic wave devices; Surface acoustic waves; Temperature; Temperature measurement; FT-IR; FWHM; SiO2 ; TC; bond angle; peak frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location
Orlando, FL
ISSN
1948-5719
Print_ISBN
978-1-4577-1253-1
Type
conf
DOI
10.1109/ULTSYM.2011.0020
Filename
6293212
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