• DocumentCode
    3226194
  • Title

    Application of fluorine doped SiO2 films for temperature compensated SAW devices

  • Author

    Matsuda, S. ; Hara, M. ; Miura, M. ; Matsuda, T. ; Ueda, M. ; Satoh, Y. ; Hashimoto, K.

  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    76
  • Lastpage
    78
  • Abstract
    In our paper, we investigates acoustic properties including temperature coefficient of elasticity (TCE) of fluorine doped silicon oxide (SiOF) films and proposes their application to the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. From the Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. Then we fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO3-substrate structure, and their device performances were evaluated. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO2-based films even when the dopant is added. In comparison with the pure SiO2 with the film thickness h of 0.3 wavelengths (λ), TCF was improved by 7.7 ppm/°C without deterioration of the effective electromechanical coupling factor K2 when r=3.8 atomic % and h=0.28λ. The F inclusion did not influence the resonator Q factors obviously when r8.8 atomic%.
  • Keywords
    Fourier transform spectra; elasticity; fluorine; infrared spectra; silicon compounds; surface acoustic wave filters; thin film devices; thin films; FT-IR spectroscopy; Fourier transform infrared spectroscopy; SAW devices; Si-O-Si atomic structure; SiO2:F; SiOF-overlay-Cu-grating-LiNbO3-substrate structure; acoustic properties; elasticity temperature coefficient; electromechanical coupling; fluorine doped silicon oxide films; radio frequency surface acoustic wave devices; temperature compensation; Atomic measurements; Films; Surface acoustic wave devices; Surface acoustic waves; Temperature; Temperature measurement; FT-IR; FWHM; SiO2; TC; bond angle; peak frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0020
  • Filename
    6293212