DocumentCode :
3226194
Title :
Application of fluorine doped SiO2 films for temperature compensated SAW devices
Author :
Matsuda, S. ; Hara, M. ; Miura, M. ; Matsuda, T. ; Ueda, M. ; Satoh, Y. ; Hashimoto, K.
fYear :
2011
fDate :
18-21 Oct. 2011
Firstpage :
76
Lastpage :
78
Abstract :
In our paper, we investigates acoustic properties including temperature coefficient of elasticity (TCE) of fluorine doped silicon oxide (SiOF) films and proposes their application to the temperature compensation of radio frequency (RF) surface acoustic wave (SAW) devices. From the Fourier transform infrared spectroscopy (FT-IR), SiOF films were expected to possess good TCE properties. Then we fabricated a series of SAW devices using the SiOF-overlay/Cu-grating/LiNbO3-substrate structure, and their device performances were evaluated. The experiments showed that the temperature coefficient of frequency (TCF) increases with the fluorine content r, as we expected from the FT-IR measurement. This means that the Si-O-Si atomic structure measurable by the FT-IR governs the TCE behavior of SiO2-based films even when the dopant is added. In comparison with the pure SiO2 with the film thickness h of 0.3 wavelengths (λ), TCF was improved by 7.7 ppm/°C without deterioration of the effective electromechanical coupling factor K2 when r=3.8 atomic % and h=0.28λ. The F inclusion did not influence the resonator Q factors obviously when r8.8 atomic%.
Keywords :
Fourier transform spectra; elasticity; fluorine; infrared spectra; silicon compounds; surface acoustic wave filters; thin film devices; thin films; FT-IR spectroscopy; Fourier transform infrared spectroscopy; SAW devices; Si-O-Si atomic structure; SiO2:F; SiOF-overlay-Cu-grating-LiNbO3-substrate structure; acoustic properties; elasticity temperature coefficient; electromechanical coupling; fluorine doped silicon oxide films; radio frequency surface acoustic wave devices; temperature compensation; Atomic measurements; Films; Surface acoustic wave devices; Surface acoustic waves; Temperature; Temperature measurement; FT-IR; FWHM; SiO2; TC; bond angle; peak frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
ISSN :
1948-5719
Print_ISBN :
978-1-4577-1253-1
Type :
conf
DOI :
10.1109/ULTSYM.2011.0020
Filename :
6293212
Link To Document :
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