• DocumentCode
    3226245
  • Title

    Immunity evaluation of inverter chains against RF power on power delivery network

  • Author

    Yoshikawa, Kenichi ; Harada, Y. ; Miura, Naruhisa ; Takeda, Nobuo ; Saito, Yuya ; Nagata, M.

  • Author_Institution
    Grad. Sch. of Syst. Inf., Kobe Univ., Kobe, Japan
  • fYear
    2013
  • fDate
    15-18 Dec. 2013
  • Firstpage
    232
  • Lastpage
    237
  • Abstract
    Direct RF power injection on a power delivery network causes timing variations of inverter chains. The amount of period jitter in an inverter chain is strongly dominated by the frequency and amplitude of sinusoidal voltage variations on its internal power supply nodes. The conduction and conversion characteristics of the RF power from an external point of injection to the sinusoidal voltage variation on the node within a chip are modeled with a chip-package-board integrated network. The period jitter is calculated in response to the sinusoidal waveform with the voltage-dependent delay characteristics of an inverter stage. The external RF power is therefore analytically related with the period jitter of an inverter chain. Comparisons are made between the calculation and measurements for a 65 nm CMOS prototype chip featuring on-chip voltage waveform monitoring functions.
  • Keywords
    CMOS analogue integrated circuits; chip-on-board packaging; invertors; timing jitter; CMOS prototype chip; chip-package-board integrated network; direct RF power injection; immunity evaluation; internal power supply nodes; inverter chains; on-chip voltage waveform monitoring functions; period jitter; power delivery network; sinusoidal voltage variations; sinusoidal waveform; size 65 nm; timing variations; voltage-dependent delay; Clocks; Delays; Inverters; Jitter; Power supplies; Radio frequency; CMOS; direct power injection; electromagnetic interference; jitter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2013 9th Intl Workshop on
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/EMCCompo.2013.6735206
  • Filename
    6735206