Title :
Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.93CH3226-8)
Abstract :
The following topics are dealt with: multichip module thermal management; system thermal characterization; thermal modeling techniques and applications; advances in thermal measurements; general thermal characterization; and component thermal characterization
Keywords :
integrated circuit testing; multichip modules; packaging; semiconductor device models; temperature measurement; thermal analysis; component thermal characterization; multichip module thermal management; system thermal characterization; thermal characterization; thermal measurements; thermal modeling techniques;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-0863-8
DOI :
10.1109/STHERM.1993.225338
