• DocumentCode
    3227376
  • Title

    Research and Design of Multifunctional Intelligent Melted Iron Analyzer

  • Author

    Zhu, Bin ; Chen, Weixu ; Lei, Yuejun

  • Author_Institution
    Zhicheng Coll., Fuzhou Univ., Fuzhou
  • Volume
    2
  • fYear
    2008
  • fDate
    20-22 Oct. 2008
  • Firstpage
    845
  • Lastpage
    848
  • Abstract
    A multifunctional intelligent melted iron analyzer is researched and designed. This device combined the function of thermal analysis for quality analysis of melted iron and ultrasonic measuring for nodularity. By thermal analysis, equation of linear regression wasused and the percentage composition of carbon, silicon and phosphorus etc. were obtained. In addition, thermal analysis was used to predict gray iron inoculation result, structure and performance. Therefore, ultrasonic measuring was adopted to be applied in this study to survey the nodularity of spheroidal graphite iron. In order to protect the analyzer far away from boiling melted iron, wireless temperature collection was adopted. The system is composed of PC104, single chip SPCE061 and other peripheral circuits. Designed temperature collection and ultrasonic measuring module, the software of data analysis and management is programmed by VB6.0 based on PC104 and windows operation system. After running for more than one year, the analyzer goes very well in the foundry.
  • Keywords
    CAD; metallurgy; production engineering computing; quality management; regression analysis; thermal analysis; ultrasonic measurement; PC104; VB6.0; Windows OS; boiling melted iron; carbon; data analysis software; data management software; gray iron inoculation; linear regression; multifunctional intelligent melted iron analyzer; percentage composition; peripheral circuits; phosphorus; quality analysis; silicon; single chip SPCE061; spheroidal graphite iron; thermal analysis; ultrasonic measuring module; wireless temperature collection; Circuits; Equations; Iron; Linear regression; Performance analysis; Protection; Semiconductor device measurement; Silicon; Temperature; Ultrasonic variables measurement; PC104; analyzer; thermal analysis; ultrasonic measuring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Computation Technology and Automation (ICICTA), 2008 International Conference on
  • Conference_Location
    Hunan
  • Print_ISBN
    978-0-7695-3357-5
  • Type

    conf

  • DOI
    10.1109/ICICTA.2008.249
  • Filename
    4659881