Title :
Research of LTCC millimeter-wave T/R module
Author_Institution :
UESTC, Chengdu, China
Abstract :
Low-Temperature Co-fired Ceramic (LTCC) technology is one type of Co-fired ceramic multi-chip module (MCM-C), which is a high-integration and multilayer- printed packaging technology. In this paper, a millimeter-wave T/R module was presented with a very compact module size of 55×13 ×10mm3 and an extremely low weight of only 31 grams by this technology, its output power was greater than 30dBm. Besides, the optimum EMC design and technology of embedded passive components were used.
Keywords :
antenna theory; ceramic packaging; millimetre wave devices; phased array radar; EMC design; LTCC millimeter-wave T/R module; co-fired ceramic multichip module; embedded passive components; gain 30 dB; low-temperature co-fired ceramic technology; millimeter wave phased array radar; multilayer-printed packaging technology; Integrated circuit interconnections; Microstrip; Millimeter wave circuits; Millimeter wave radar; Millimeter wave technology; Packaging; Phased arrays; Radar antennas; Stripline; Switches;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
DOI :
10.1109/ICMMT.2010.5524753
