DocumentCode :
322765
Title :
EMI evaluation and hardening-a systems approach
Author :
Chakravarti, Bhudeb
Author_Institution :
EMI/EMC Centre, Hyderabad, India
fYear :
1997
fDate :
3-5 Dec 1997
Firstpage :
209
Lastpage :
212
Abstract :
Electromagnetic compatibility (EMC) has become a major thrust in the industries who are involved in export of electronic goods. As per the latest European norms, all electronic goods exported to the European market has to clear EMC requirements. In absence of any legislation in India, the industries in India are lacking any systematic approach to make their product compatible to EMI. Due to this reason, quick-fix methods are being used to solve the problems which are encountered during EMI testing of their products. This process is time consuming and expensive. The industries can cut their expenses if they follow a systems approach to EMC which will make their system EMI free. This paper discusses a systematic approach which the designers should follow in the design stage itself to make their product less prone to EMI. The paper also describes guidelines to be followed during mechanical design and in the manufacturing stage
Keywords :
commerce; electromagnetic compatibility; electromagnetic interference; electronic equipment manufacture; electronic equipment testing; radiation hardening (electronics); EMC; EMI evaluation; EMI hardening; EMI testing; European market; European norms; India; electromagnetic compatibility; electronic goods; equipment manufacture; export; legislation; mechanical design; quick-fix methods; systems approach; Consumer electronics; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic interference; Electronics industry; Guidelines; Industrial electronics; Legislation; Pulp manufacturing; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Interference and Compatibility '97. Proceedings of the International Conference on
Conference_Location :
Hyderabad
Print_ISBN :
81-900652-0-3
Type :
conf
DOI :
10.1109/ICEMIC.1997.669799
Filename :
669799
Link To Document :
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