• DocumentCode
    3227750
  • Title

    Room-temperature diamond seeding and microwave plasma enhanced CVD growth of nanodiamond with a tungsten interfacial layer

  • Author

    Chu, Yueh-Chieh ; Jiang, Gerald ; Chang, Chi ; Ting, Jyh-Ming ; Lee, Hsin-Le ; Tzeng, Yonhua

  • Author_Institution
    Inst. of Microelectron., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2011
  • fDate
    15-18 Aug. 2011
  • Firstpage
    1367
  • Lastpage
    1370
  • Abstract
    This paper reports on room-temperature high-density diamond seeding for low-temperature microwave plasma enhanced chemical vapor deposition of nanocrystalline diamond (NCD) on W/Si substrates. A tungsten layer acts as a diamond nucleation-enhancing layer. Formation of tungsten-carbide (WC) complex increases the initial nucleation density and plays an important role in facilitating diamond growth characteristics. Microwave plasma-enhanced chemical vapor deposition is applied to synthesize diamond films in Ar diluted by methane without hydrogen additives at low temperature. NCD seeding and film formation were investigated as a function of the thickness of tungsten interfacial layer. Raman spectroscopy, SEM, AFM and TEM were applied to characterize NCD films in order to gain insight into the initial stage of NCD diamond synthesis.
  • Keywords
    Raman spectra; atomic force microscopy; diamond; elemental semiconductors; nanofabrication; nanostructured materials; nucleation; plasma CVD; scanning electron microscopy; semiconductor growth; transmission electron microscopy; wide band gap semiconductors; AFM; C; Raman spectroscopy; SEM; TEM; W-Si; W-Si substrates; diamond growth characteristics; diamond nucleation-enhancing layer; high-density diamond seeding; initial nucleation density; low-temperature microwave plasma enhanced chemical vapor deposition; methane; microwave plasma enhanced chemical vapor deposition growth; nanocrystalline diamond film formation; nanocrystalline diamond seeding; nanocrystalline diamond synthesis; nanodiamond; temperature 293 K to 298 K; tungsten interfacial layer thickness; tungsten-carbide complex formation; Diamond-like carbon; Films; Plasma temperature; Silicon; Substrates; Tungsten; nanocrystalline diamond; nucleation density; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
  • Conference_Location
    Portland, OR
  • ISSN
    1944-9399
  • Print_ISBN
    978-1-4577-1514-3
  • Electronic_ISBN
    1944-9399
  • Type

    conf

  • DOI
    10.1109/NANO.2011.6144477
  • Filename
    6144477