Title :
Photonics for Z-axis stacking of multi-chip modules
Author :
Carson, R.F. ; Lovejoy, M.L. ; Lear, K.L. ; Warren, M.E. ; Blum, O. ; Seigal, P.K. ; Craft, D.C. ; Kilcoyne, S.P. ; Patrizi, G.A.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
fDate :
30 Oct-2 Nov 1995
Abstract :
The device designs used for this work are based on highly efficient vertical-cavity surface emitting lasers, connected to corresponding photoreceivers. In order to meet the constraints of packaging, the optical system used in the design is implemented by the integration of microlenses into the laser and photoreceiver substrates
Keywords :
integrated optoelectronics; laser cavity resonators; lenses; multichip modules; optical interconnections; optical receivers; semiconductor device packaging; semiconductor lasers; substrates; surface emitting lasers; GaAs; Z-axis stacking; device design; highly efficient vertical-cavity surface emitting lasers; laser substrates; microlens integration; multi-chip modules; optical system design; packaging; photonics; photoreceiver substrates; photoreceivers; Integrated optics; Lenses; Microoptics; Optical design; Packaging; Photonics; Stacking; Stimulated emission; Surface emitting lasers; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2450-1
DOI :
10.1109/LEOS.1995.484628
