Title :
CVD diamond wafers for thermal management application in electronic packaging
Author :
Windischmann, H.
Author_Institution :
Norton Diamond Film, Northboro, MA, USA
Abstract :
This paper presents the progress made in developing a production-worthy 7 inch diameter CVD diamond wafer fabrication process by DC arc jet. Technical issues associated with fabricating diamond wafers are presented, along with performance and repeatability data from a pilot plant production run
Keywords :
ceramics; chemical vapour deposition; cooling; diamond; integrated circuit packaging; jets; thermal conductivity; 7 in; C; CVD diamond industrial ceramic; CVD diamond wafer fabrication process; CVD diamond wafers; DC arc jet fabrication; diamond wafers; electronic packaging; performance data; pilot plant production run; production-worthy CVD diamond wafer fabrication process; repeatability data; thermal conductivity; thermal management application; Costs; Electronic packaging thermal management; Electronics packaging; Fabrication; Hydrogen; Production; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal stresses;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670784
