DocumentCode
322868
Title
CVD diamond wafers for thermal management application in electronic packaging
Author
Windischmann, H.
Author_Institution
Norton Diamond Film, Northboro, MA, USA
fYear
1998
fDate
15-17 Apr 1998
Firstpage
224
Lastpage
228
Abstract
This paper presents the progress made in developing a production-worthy 7 inch diameter CVD diamond wafer fabrication process by DC arc jet. Technical issues associated with fabricating diamond wafers are presented, along with performance and repeatability data from a pilot plant production run
Keywords
ceramics; chemical vapour deposition; cooling; diamond; integrated circuit packaging; jets; thermal conductivity; 7 in; C; CVD diamond industrial ceramic; CVD diamond wafer fabrication process; CVD diamond wafers; DC arc jet fabrication; diamond wafers; electronic packaging; performance data; pilot plant production run; production-worthy CVD diamond wafer fabrication process; repeatability data; thermal conductivity; thermal management application; Costs; Electronic packaging thermal management; Electronics packaging; Fabrication; Hydrogen; Production; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-4850-8
Type
conf
DOI
10.1109/ICMCM.1998.670784
Filename
670784
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