DocumentCode
322874
Title
Stress comparison of TBGA, MBGA, and ViperBGATM using the PAQC chip
Author
Evans, Thomas C. ; Bright, William T., II ; Kenyon, E. Allen
Author_Institution
Symbios Logic Inc., Fort Collins, CO, USA
fYear
1998
fDate
15-17 Apr 1998
Firstpage
399
Lastpage
404
Abstract
A strain gauge on the PAQC (package assembly qualification & characterization) chip is used to make a comparison of mechanical stress over temperature between three different package types. The tape-ball grid array (tapeBGA), metalBGA, and ViperBGATM are assembled and stress tested as part of an ongoing reliability evaluation. Stress resistor values are sampled and compared, before production lots of each type are put through qualification testing. After qualification tests are completed, stress resistor values are sampled again and compared to the original data
Keywords
integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microassembling; resistors; stress analysis; test equipment; thermal stresses; MBGA; PAQC chip; TBGA; ViperBGA; assembly; mechanical stress; metal-ball grid array; package assembly qualification/characterization chip; package types; production lots; qualification testing; reliability; strain gauge; stress comparison; stress resistor; stress resistor value sampling; stress test; tape-ball grid array; Assembly; Capacitive sensors; Logic; Qualifications; Resistors; Semiconductor device packaging; Sensor phenomena and characterization; Silicon; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-4850-8
Type
conf
DOI
10.1109/ICMCM.1998.670815
Filename
670815
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