DocumentCode :
322876
Title :
A low-cost MCM implementation for 100-Hz TV up-conversion
Author :
Langenkamp, U. ; Menke, M. ; Plan, M. ; Runkel, P. ; Schu, M. ; Stumpf, B. ; Heimgärtner, R. ; Schätzler, B. ; Gottinger, R.
Author_Institution :
Siemens AG, Munich, Germany
fYear :
1998
fDate :
15-17 Apr 1998
Firstpage :
537
Lastpage :
542
Abstract :
A system-on-chip covering all 100 Hz TV digital signal processing functions has been implemented as a MCM in a P-MQFP-64 package. The design, architecture, test concept and special arrangement of two chips assembled together are presented. The yield improvement of the larger memory chip achieved by redundancy optimization has led to a profitable product with higher yield and lower costs than previous multi-package solutions. This development was based on state-of-the-art technology, using materials that were as standard as possible and included DFT (design for testability) right from the outset, i.e. sufficient flexibility to test every block of a multichip module. The time-to-market requirements were effectively satisfied by implementing the system as a MCM. The rough estimate made here shows that when it comes to implementing future high-performance on-chip systems with advanced logic and memory integration, the obvious choice is an emergent embedded DRAM technology
Keywords :
DRAM chips; circuit optimisation; design for testability; digital signal processing chips; frequency convertors; integrated circuit design; integrated circuit packaging; integrated circuit testing; integrated circuit yield; microassembling; multichip modules; plastic packaging; redundancy; television equipment; video signal processing; 100 Hz; MCM; MCM implementation; MCM test flexibility; P-MQFP-64 package; TV digital signal processing functions; TV up-conversion; chip assembly; chip yield; design for testability; embedded DRAM technology; logic/memory integration; memory chip; multi-package costs; multichip module; on-chip systems; package architecture; package design; package test; redundancy optimization; system-on-chip; time-to-market; Assembly; Cost function; Design for testability; Digital signal processing chips; Materials testing; Multichip modules; Packaging; Standards development; System-on-a-chip; TV;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
Type :
conf
DOI :
10.1109/ICMCM.1998.670838
Filename :
670838
Link To Document :
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