Acoustic inspection of high-density-interconnects for 3D-integration

The increasing demand on the complexity of microelectronic components will soon require architectures that build in the third dimension. A number of current projects and world-wide research in this field focuses on technologies that aim at combining individual devices on wafer level into complex systems that have a variety of features. However, the interfaces available for interconnecting the individual components are limited and thus a three-dimensional approach will provide the ultimate solution. An architecture that enables the above mentioned features will largely challenge conventional inspection techniques for quality control and failure analysis. Of particular interest for 3D-integrated devices are methods that operate non-or semi-destructively.