Multi-Gbps wireless link by UWB: Chipset in CMOS from 6 GHz to 60 GHz

This paper presents the attractive features and challenges of developing multi gigabit persecond wireless connectivity by UWB technology. Low complexity and low power UWB transceivers´ architecture in both lower 6 GHz UWB band and 60 GHz millimeter wave band are implemented. Chipset development is successfully demonstrated in both 6 -GHz UWB transceiver IC in 0.18 μm CMOS and 60-GHz MODEM in 90 nm CMOS followed by firstly concepts of proven realized in module level. We will be discussing and describing an enhanced RF modeling cum IC validation methodology, based on electromagnetic simulation without test structures pre-fabrication and driven directly by IC design needs. Our new approach enabled key block ICs to be designed, such as low noise amplifiers and oscillators, as well as a complete On-Off-Keying MODEM with integrated antenna with first time design success. The innovative on-chip antenna using artificial magnetic conductor is also 1^st time realized for total integration. The research and development outlook will also be presented.