DocumentCode
3229875
Title
DPlace2.0: A stable and efficient analytical placement based on diffusion
Author
Luo, Tao ; Pan, David Z.
Author_Institution
Univ. of Texas at Austin, Austin
fYear
2008
fDate
21-24 March 2008
Firstpage
346
Lastpage
351
Abstract
Nowadays a placement problem often involves multi-million objects and excessive fixed blockages. We present a new global placement algorithm that scales well to the modern large-scale circuit placement problems. We simulate the natural diffusion process to spread cells smoothly over the placement region, and use both analytical and discrete techniques to improve the wire length. Although any analytical wire length technique can be used in our new framework, by using the quadratic wire length model, the hessian of our formulation is extremely sparse compared with conventional formulations, which brings 24x speed up on quadratic solver. We also propose a wire linearization technique that transform quadratic star model into HPWL exactly. The overall runtime of our tool is close to the fastest placement tool in existing literature and significantly better than others. And meanwhile, we obtain competitive wire length results to the best known ones. The average total wire length is 2.2% higher than mPL6, 0.2%, 3.1%, and 9.1% better than FastPlace3.0, APlace2.0, and Capol0.2 respectively.
Keywords
diffusion; integrated circuit design; integrated circuit modelling; linearisation techniques; quadratic programming; DPIace2.0; analytical placement; analytical wire length technique; global placement algorithm; modern large-scale circuit placement problems; natural diffusion process; placement region; quadratic star model; quadratic wire length model; wire linearization technique; Analytical models; Circuit simulation; Computational modeling; Constraint optimization; Diffusion processes; Large-scale systems; Linearization techniques; Pins; Runtime; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
Conference_Location
Seoul
Print_ISBN
978-1-4244-1921-0
Electronic_ISBN
978-1-4244-1922-7
Type
conf
DOI
10.1109/ASPDAC.2008.4483972
Filename
4483972
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