DocumentCode :
3231124
Title :
Novel high efficiency broadband Ku band power combiner
Author :
Wu, Danyu ; Chen, Xiaojuan ; Chen, Gaopeng ; Liu, Xinyu
Author_Institution :
Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China
fYear :
2010
fDate :
8-11 May 2010
Firstpage :
258
Lastpage :
261
Abstract :
High power solid-state power amplifiers require a high efficiency power dividing/combining structure to keep the power loss as low as possible. The heat sinking capability of the divider/combiner also limits its maximum output power with continues wave (CW) configuration. In this paper, we introduce a novel 8-way Ku band power divider/combiner system, it demonstrate advantages of low loss, broadband and good heat sinking capability simultaneously. As its sub-components, low loss probes for waveguide-to-microstrip transition and low loss broadband 1-to-2 power combiners are designed and fabricated. The measured back-to-back insertion loss of the whole 8-way power combiner is lower than 0.5dB in the whole Ku band, and the corresponding combining efficiency is as high as 94.5%. The simulated thermal resistance of the system is as low as 0.2°C/W, indicating the proposed power combiner is able to produce 50W of CW output power with commercial available Monolithic Microwave Integrated Circuits (MMICs).
Keywords :
MMIC; heat sinks; microstrip transitions; power amplifiers; power combiners; waveguide transitions; 8-way power combiner; Ku band; continues wave configuration; heat sinking capability; insertion loss; monolithic microwave integrated circuits; power 50 W; power loss as; solid-state power amplifiers; thermal resistance; waveguide-to-microstrip transition; Broadband amplifiers; Cogeneration; Heat sinks; High power amplifiers; MMICs; Power amplifiers; Power combiners; Power generation; Solid state circuits; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
Type :
conf
DOI :
10.1109/ICMMT.2010.5524923
Filename :
5524923
Link To Document :
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