• DocumentCode
    3231162
  • Title

    Synthesis of c-tilted AlN films with a good tilt and thickness uniformity

  • Author

    Moreria, Milena ; Bjurström, Johan ; Kubart, Tomas ; Kuzavas, Björn ; Katardjiev, Ilia

  • Author_Institution
    Dept. of Eng. Sci., Uppsala Univ., Uppsala, Sweden
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    1238
  • Lastpage
    1241
  • Abstract
    This communication describes a method for the deposition of thin piezoelectric AlN films with an inclined c-axis relative to the surface normal. Further, the tilt over the wafer is sufficiently uniform and exhibits a planar symmetry as well as good thickness uniformity. Careful control of both the nucleation and growth stages is needed to obtain tilted films with excellent quality. Thus in the nucleation state, it is argued that two independent mechanisms, namely seed layer texture and/or surface roughness, are mainly responsible for the subsequent titled growth. To achieve the latter, however, a certain directionality of the deposition flux is also necessary. The directionality of the deposition flux is achieved through the use of an array of linear magnetrons tilted under a certain angle with respect to the substrate normal.
  • Keywords
    III-V semiconductors; aluminium compounds; nucleation; piezoelectric thin films; semiconductor growth; semiconductor thin films; sputter deposition; surface roughness; texture; wide band gap semiconductors; AlN; aluminum nitride piezoelectric thin films; deposition flux; growth stages; linear magnetron deposition; nucleation; planar symmetry; seed layer texture; surface roughness; thickness uniformity; Acoustics; Films; Magnetrons; Rough surfaces; Substrates; Surface roughness; Surface treatment; AlN; c-axis tilt; piezoelectric; shear waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0305
  • Filename
    6293473