• DocumentCode
    3231228
  • Title

    ReSP: A non-intrusive Transaction-Level Reflective MPSoC Simulation Platform for design space exploration

  • Author

    Beltrame, Giovanni ; Bolchini, Cristiana ; Fossati, Luca ; Miele, Antonio ; Sciuto, Donatella

  • Author_Institution
    Europeran Space Agency, Noordwijk
  • fYear
    2008
  • fDate
    21-24 March 2008
  • Firstpage
    673
  • Lastpage
    678
  • Abstract
    This paper presents ReSP (Reflective Simulation Platform), a Transaction-Level multi-processor simulation platform based on SystemC and Python; SystemC is a standard language for system modeling and verification, and Python provides the platform with reflective capabilities. These are employed to give the designer an easy way to specify the architecture of a system, simulate the given configuration and perform automatic analysis on it. ReSP enables SystemC and Python interoperability through automatic Python wrapper generation. We show that the overhead associated with the Python intermediate layer is around 1%, therefore execution speed is not compromised. The advantages of our approach are: (a) easy integration of external IPs (b) fine grain control of the simulation (c) effortless integration of tools for system analysis and design space exploration. A case study shows how the platform can be extended to support system reliability assessment.
  • Keywords
    hardware-software codesign; logic CAD; multiprocessing systems; system-on-chip; Python; SystemC; design space exploration; multiprocessor system-on-chip; nonintrusive transaction-level reflective simulation platform; system modeling; transaction-level multiprocessor simulation; Analytical models; Automatic control; Computer architecture; Hardware; Modeling; Performance analysis; Software libraries; Software systems; Space exploration; System analysis and design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2008. ASPDAC 2008. Asia and South Pacific
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-1921-0
  • Electronic_ISBN
    978-1-4244-1922-7
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2008.4484036
  • Filename
    4484036