Electrical, thermal and mechanical properties of epoxy composites with hybrid micro- and nano-sized fillers for electronic packaging

Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNT) exhibit high electrical and thermal conductivity. Moreover CNT improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesive filled with silver flakes and carbon nanotubes were investigated. Thermal and electrical conductivities were measured as well as improved mechanical properties were evaluated based on the reliability tests of joints made of tested material. The electrical, thermal and mechanical properties were consistent with the morphologies of the hybrid composites characterized by SEM.