Title :
Notice of Retraction
Surface activated bonding as nano-packaging technology
Author :
Suga, T. ; Fujino, M. ; Kondoh, R.
Author_Institution :
Sch. of Eng., Univ. of Tokyo, Tokyo, Japan
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This paper describes two examples of nano-packaging technology using surface activated bonding (SAB): vertical contact of CNTs via to metal substrate, and heterogeneous bonding such as Si-Si3N4 and Si-Al2O3 wafers. In the both cases, controlled layer in nanometer-scale of the interface is essential in achieving the desired characteristics of the bonded interface..
Keywords :
bonding processes; carbon nanotubes; electronics packaging; Si-Al2O3; Si-Si3N4; bonded interface.; carbon nanotube; controlled layer; heterogeneous bonding; metal substrate; nanometer-scale; nanopackaging technology; surface activated bonding; Bonding; Conferences; Metals; Silicon; Surface treatment; Wafer bonding;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4577-1514-3
Electronic_ISBN :
1944-9399
DOI :
10.1109/NANO.2011.6144664
