DocumentCode :
3231622
Title :
A safe operating area model for SOI lateral IGBTs
Author :
Matsudai, Tomoko ; Funaki, Hideyuki ; Nakagawa, Akio
Author_Institution :
Mater. & Devices Res. Labs., Toshiba Corp., Kawasaki, Japan
fYear :
1997
fDate :
26-29 May 1997
Firstpage :
41
Lastpage :
44
Abstract :
This paper reports, for the first time, a mechanism, which limits the safe operating area (RBSOA). We numerically verify that a RBSOA limiting mechanism is that the device breakdown voltage dynamically reduces when the net positive sheet charge in the SOI layer exceeds the optimum positive sheet charge determined by the SOI-Resurf principle. It was found that the forward SOA for the steady conduction state is far larger than the reverse SOA for switching transients
Keywords :
insulated gate bipolar transistors; semiconductor device models; semiconductor device reliability; short-circuit currents; silicon-on-insulator; transient analysis; RBSOA limiting mechanism; SOI lateral IGBTs; SOI-Resurf principle; device breakdown voltage; net positive sheet charge; safe operating area model; short circuit condition; steady conduction state; switching transients; Breakdown voltage; Circuit testing; Current density; Impact ionization; Insulated gate bipolar transistors; Integrated circuit technology; Laboratories; Semiconductor optical amplifiers; Steady-state; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location :
Weimar
ISSN :
1063-6854
Print_ISBN :
0-7803-3993-2
Type :
conf
DOI :
10.1109/ISPSD.1997.601426
Filename :
601426
Link To Document :
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