• DocumentCode
    3231656
  • Title

    Exhaust deposit clean process using a remote NF3 plasma (MAC-ICP)

  • Author

    Sanchez, Errol ; Li, Steven ; Ho, Henry ; Binh Bul ; Chang, Yu ; Chiliang Chen ; Foxhoven, Dan ; Chen, Chiliang ; Littau, Karl ; Beinglass, Israel

  • Author_Institution
    Appl. Mater. Inc., Santa Clara, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    150
  • Lastpage
    155
  • Abstract
    Polysilicon deposition process byproducts in the form of exhaust powder deposits present time consuming and periodic maintenance that includes manual cleaning of exhaust components. A technology was therefore developed that allows a dramatic reduction in mean time between cleans thereby significantly increasing uptime of polysilicon deposition tools. Powder deposits and accompanying adsorbed gases throughout the entire exhaust line down to the pump inlet and silencer are cleaned in-situ, without trapping, by reacting with fluorine radicals from a remote NF3 plasma. A novel compact remote plasma unit-a magnetically coupled inductively coupled plasma (MAC-ICP)-was developed for this immediate purpose and successfully integrated into the existing single-wafer polysilicon deposition system. The evaluation, optimization, automation, and process integration of the cleaning technique is presented
  • Keywords
    chemical vapour deposition; elemental semiconductors; semiconductor growth; silicon; sputter etching; surface cleaning; CVD; Si; adsorbed gases; automation; compact remote plasma unit; etch rate; exhaust powder deposits; fluorine radicals; in-situ cleaning; magnetically coupled inductively coupled plasma; mean time between cleans; plasma etching; polysilicon deposition process byproducts; process integration; process repeatability; remote NF3 plasma cleaning; single-wafer polysilicon deposition system; Cleaning; Contamination; Couplings; Plasma applications; Plasma chemistry; Powders; Pressure control; Productivity; Silicon; Valves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5217-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1999.798208
  • Filename
    798208