DocumentCode
3231656
Title
Exhaust deposit clean process using a remote NF3 plasma (MAC-ICP)
Author
Sanchez, Errol ; Li, Steven ; Ho, Henry ; Binh Bul ; Chang, Yu ; Chiliang Chen ; Foxhoven, Dan ; Chen, Chiliang ; Littau, Karl ; Beinglass, Israel
Author_Institution
Appl. Mater. Inc., Santa Clara, CA, USA
fYear
1999
fDate
1999
Firstpage
150
Lastpage
155
Abstract
Polysilicon deposition process byproducts in the form of exhaust powder deposits present time consuming and periodic maintenance that includes manual cleaning of exhaust components. A technology was therefore developed that allows a dramatic reduction in mean time between cleans thereby significantly increasing uptime of polysilicon deposition tools. Powder deposits and accompanying adsorbed gases throughout the entire exhaust line down to the pump inlet and silencer are cleaned in-situ, without trapping, by reacting with fluorine radicals from a remote NF3 plasma. A novel compact remote plasma unit-a magnetically coupled inductively coupled plasma (MAC-ICP)-was developed for this immediate purpose and successfully integrated into the existing single-wafer polysilicon deposition system. The evaluation, optimization, automation, and process integration of the cleaning technique is presented
Keywords
chemical vapour deposition; elemental semiconductors; semiconductor growth; silicon; sputter etching; surface cleaning; CVD; Si; adsorbed gases; automation; compact remote plasma unit; etch rate; exhaust powder deposits; fluorine radicals; in-situ cleaning; magnetically coupled inductively coupled plasma; mean time between cleans; plasma etching; polysilicon deposition process byproducts; process integration; process repeatability; remote NF3 plasma cleaning; single-wafer polysilicon deposition system; Cleaning; Contamination; Couplings; Plasma applications; Plasma chemistry; Powders; Pressure control; Productivity; Silicon; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5217-3
Type
conf
DOI
10.1109/ASMC.1999.798208
Filename
798208
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