DocumentCode
3231965
Title
Wafer fab conversion through theory of constraint project management techniques
Author
Fritz, Jaka ; Benjamin, Jeanette
Author_Institution
Intersil, USA
fYear
1999
fDate
1999
Firstpage
202
Lastpage
203
Abstract
Summary form only given. The drive for manufacturing on larger diameter wafers has been strong for the past few years and is projected to continue. Although the benefits of running production on larger diameter wafers has long been established throughout the industry, the capital investment to start a 300 mm or 200 mm fab from scratch can be difficult to justify. One alternative to the “brick and mortar” option is to convert an existing facility. Faced with increasing competitive pressures, Harris Semiconductor Mountaintop Operations, made the strategic decision to convert their existing facility. This paper will describe in detail how the Mountaintop team shut down an old 5 inch facility, converted the necessary tools and fabrication area to 6 inch capability, and began a production ramp-up in 6 short months. The converted fab, approximately 6,700 square feet, is now integrated into the pre-existing 6 inch facility. For optimum work flow, layout in the newly constructed area was designed to mirror the process functions of the existing fab, with cleanroom areas rated as class 10 or better. Capital investment was minimal and no new production tools were purchased
Keywords
clean rooms; constraint theory; integrated circuit manufacture; project management; Harris Semiconductor; cleanroom areas; constraint project management techniques; large diameter wafers; process functions; production ramp-up; wafer fab conversion; Constraint theory; Continuous improvement; Design engineering; Engineering management; Investments; Manufacturing; Production; Project management; Resource management; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5217-3
Type
conf
DOI
10.1109/ASMC.1999.798223
Filename
798223
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