DocumentCode
3232158
Title
Analytical solutions of surface acoustic wave propagation in functionally graded plates with the homotopy analysis method
Author
Liming Gao ; Ji Wang ; Zheng Zhong
Author_Institution
Sch. of Mech. Eng., Shanghai Inst. of Technol., Shanghai, China
fYear
2011
fDate
18-21 Oct. 2011
Firstpage
1696
Lastpage
1699
Abstract
Since the governing equations of the propagation of elastic waves in functionally graded materials (FGMs) are differential equations with variable coefficients, it is difficult to solve them with existing analytical methods. In the present paper, the homotopy analysis method is used to study the propagation of surface acoustic waves in FGM plates. The numerical results confirm early conclusions that the selection of hardening or softening of materials in the thickness direction will cause the reduction or increase of deformation on the surface, which is an phenomena worth to explore for practical engineering practices which generally prefers the change of thickness rather than material properties. While the importance of FGM in many structural and functional applications has been recognized, analytical solutions to guide the precise selection and applications have to be provided by solving the seemingly unsolvable equations.
Keywords
deformation; differential equations; elastic waves; functionally graded materials; hardening; nonlinear equations; surface acoustic waves; wave equations; analytical methods; differential equations; elastic wave propagation; functional applications; functionally graded materials; functionally graded plates; homotopy analysis method; materials hardening; materials softening; practical engineering practices; structural applications; surface acoustic wave propagation; surface deformation; thickness change; variable coefficients; Boundary conditions; Differential equations; Equations; Material properties; Surface acoustic waves; FGM; homotopy; propagation; vibration; wave;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location
Orlando, FL
ISSN
1948-5719
Print_ISBN
978-1-4577-1253-1
Type
conf
DOI
10.1109/ULTSYM.2011.0423
Filename
6293523
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