Title :
A pseudomorphic GaAs/GaInAs/AlGaAs SISFET
Author :
Schmidt, P.E. ; Barbier, E. ; Collot, P. ; Pons, D.
Author_Institution :
Thomson CSF Central Res. Lab., Orsay, France
Abstract :
The authors report a pseudomorphic semiconductor-insulator-semiconductor field-effect transistor (PM-SISFET) that uses a thin layer of undoped GaInAs instead of GaAs as the channel-forming layer. The device consists of an undoped AlGaAs barrier layer, a heavily doped n-type GaAs gate, and an upper GaInAs contact layer. With this structure, the device has a naturally negative threshold voltage. The structures were grown by molecular beam epitaxy. The devices were fabricated using, as for conventional GaAs SISFETs, self-aligned ion implantation and rapid thermal annealing (RTA). High-resolution photoluminescence spectra at 4.2 K for both the as-grown layer and after RTA have a FWHM (full width at half-maximum) of 3.1 MeV for a 120-Å-thick GaInAs channel layer with an In content of about 12%. These measurements indicate that no structural degradation of the strained layer occurred during annealing. To compare performance, the authors also grew and processed conventional GaAs/AlGaAs/n+-GaAs SISFETs. At 300 K, the 1-μm-gate-length devices showed transconductances and drain currents in excess of 270 mS/mm and 250 mA/mm, respectively, for PM-SISFETs compared to 240 mS/mm and 200 mA/mm, respectively, for similar conventional SISFETs
Keywords :
III-V semiconductors; aluminium compounds; gallium arsenide; incoherent light annealing; indium compounds; insulated gate field effect transistors; ion implantation; luminescence of inorganic solids; photoluminescence; semiconductor-insulator-semiconductor structures; 1 micron; 270 ms; 300 K; 4.2 K; GaAs-GaInAs-AlGaAs; SISFETs; barrier layer; channel-forming layer; contact layer; drain currents; gate length; heavily doped n-type GaAs gate; molecular beam epitaxy; negative threshold voltage; photoluminescence spectra; pseudomorphic semiconductor-insulator-semiconductor field-effect transistor; rapid thermal annealing; self-aligned ion implantation; strained layer; transconductances; Buffer layers; Contact resistance; Electrical resistance measurement; Etching; Gallium arsenide; HEMTs; Laboratories; Photoluminescence; Rapid thermal annealing; Threshold voltage;
Conference_Titel :
High Speed Semiconductor Devices and Circuits, 1989. Proceedings., IEEE/Cornell Conference on Advanced Concepts in
Conference_Location :
Ithaca, NY
DOI :
10.1109/CORNEL.1989.79824