Effects of shorting pin on the Substrate Integrated Cylindrical Cavity

Author

Xiu-zhen, Luan ; Ke-jun, Tan ; Shao-Jun, Fang

Author_Institution

Coll. of Inf. Sci. & Technol., Dalian Maritime Univ., Dalian, China

fYear

2010

fDate

8-11 May 2010

Firstpage

1242

Lastpage

1244

Abstract

Substrate Integrated Cylindrical Cavity (SICC) can be used to design compact planar circuits. For the same size, SICC loaded with shorting pin can resonate at higher frequency than no shorting pin SICC. This property can be used to implement the millimeter wave circuits. In this paper, the effects of shorting pin on SICC are analyzed theoretically. With the help of electromagnetic simulation software, the effects of shorting pin position, radius and number on the resonant frequency of SICC are studied. Some results and conclusions are given in the paper, they will be useful for the SICC based millimeter wave device design.

Keywords

millimetre wave circuits; planar waveguides; substrate integrated waveguides; SICC based millimeter wave device design; compact planar circuit design; electromagnetic simulation software; millimeter wave circuits; resonant frequency; shorting pin effect; substrate integrated cylindrical cavity; substrate integrated waveguide; Dielectric substrates; Inductance; Microstrip; Millimeter wave communication; Millimeter wave devices; Millimeter wave integrated circuits; Millimeter wave technology; Pins; RLC circuits; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-5705-2

Type

conf

DOI

10.1109/ICMMT.2010.5524985

Filename

5524985