An effective end point detector on oxide CMP by motor current

We have proposed an end point detector (EPD) on Chemical Mechanical Polishing (CMP) by motor current. The conventional optic EPD can measure the thickness of dielectric film, but it is not easy do “in-situ” measurement. And the signal is not so clear even do “in situ” measurement. Instead of optic EPD, the EPD by motor current method can take the end point signal accuracy. We can apply the motor current method of EPD into STI, ILD, and IMD CMP process. The motor current EPD of STI, ILD, and IMD pattern wafers were demonstrated