A new method for the micro-tensile testing of thin film

Author

Liu, Rui ; Li, Xueping ; Wang, Hong ; Ding, Guifu ; Yang, Chunsheng ; Yang, Zhuoqing

Author_Institution

Res. Inst. of Micro/Nanometer Sci. & Technol., Shanghai Jiaotong Univ., Shanghai

fYear

2008

fDate

6-9 Jan. 2008

Firstpage

112

Lastpage

115

Abstract

A new method for testing the mechanical characterization of freestanding thin films is designed. The new micro-tensile structure is suitable for testing thin films with large strain. The uniaxial tension has higher accuracy compared with other micro-tensile methods. Metal thin film with different thickness could be tested by this method, and the results shows that the method is simple and reliable. The S-shape support springs could decrease the inaccuracy which comes from plastic yield of support beam. The measured Young´s modulus of Ni thin film is about 32 GPa, and the tensile strength is about 750 MPa.

Keywords

metallic thin films; tensile strength; tensile testing; S-shape support springs; Youngs modulus; freestanding thin film; mechanical characterization; metal thin film; micro tensile testing; plastic yield; uniaxial tension; Fabrication; Micromechanical devices; Plastic films; Polymer films; Silicon; Springs; Strain measurement; System testing; Transistors; Uniaxial strain; MEMS; mechanical properties; tensile testing; thin film;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on

Conference_Location

Sanya

Print_ISBN

978-1-4244-1907-4

Electronic_ISBN

978-1-4244-1908-1

Type

conf

DOI

10.1109/NEMS.2008.4484298

Filename

4484298