Title :
Wide band antenna array using bowtie-shaped microstrip patch antenna
Author :
Zhang, Fan ; Zhang, Fu-Shun ; Yang, Ya-Bing ; Zhang, Zheng
Author_Institution :
Nat. Key Lab. of Antennas & Microwave Technol., Xidian Univ., Xi´´an, China
Abstract :
A bowtie-shaped electromagnetic coupling microstrip patch antenna (ECMSA) was exploited. The antenna is realized by stacking two substrate layers which are separated by a ground plane. The bowtie-shaped radiation patch is fed by a 50 Ω microstrip line, which is coupled to the microstrip feedline through a dumbbell-shaped aperture on the ground plane. The antenna exhibits a good performance with ease of fabrication. Comprised by the proposed ECMSA and a 1 to 4 equal-distribution power divider, a 4 elements linear array is fabricated and investigated. Along with ingenious efforts made to improve the impedance bandwidth, several techniques are also applied to broaden the beamwidth of the antenna array. Measurements of voltage standing wave ratio (VSWR), radiation pattern, and gain are carried out in an anechoic chamber to validate the design process. Details of the numerical and experimental results are presented and discussed.
Keywords :
antenna feeds; antenna radiation patterns; bow-tie antennas; broadband antennas; electromagnetic coupling; linear antenna arrays; microstrip antenna arrays; microstrip lines; power dividers; anechoic chamber; antenna array beamwidth; bowtie-shaped electromagnetic coupling microstrip patch antenna; dumbbell-shaped aperture; equal-distribution power divider; ground plane; impedance bandwidth; linear array element; microstrip feedline; radiation pattern; resistance 50 ohm; substrate layers; voltage standing wave ratio measurements; wideband antenna array; Apertures; Broadband antennas; Electromagnetic coupling; Fabrication; Linear antenna arrays; Microstrip antenna arrays; Microstrip antennas; Patch antennas; Power dividers; Stacking;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
DOI :
10.1109/ICMMT.2010.5524993