• DocumentCode
    3232599
  • Title

    Application of ADC techniques to characterize yield-limiting defects identified with the overlay of E-test/inspection data on short loop process testers

  • Author

    Henry, Todd ; Patterson, Oliver ; Brown, Greg

  • Author_Institution
    Lucent Technol., Orlando, FL, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    330
  • Lastpage
    337
  • Abstract
    Automatic defect classification, using a combination of CRS IMPACT TM ADC and 4300+ SEM ADC based approaches, can significantly improve data integrity and the rate of yield-limiting defect characterization. Implementation of ADC can enhance yield learning rates since it can improve the defect classification speed and improve the accuracy of the results. The data shows that both optical and SEM ADC approaches offer their own unique advantages. Optical ADC offers a faster significantly cheaper solution with less accuracy. Higher classification accuracy is obtained from the SEM based approach due to the higher magnifications coupled with the additional Z-information available only with tilted images. The ultimate approach would involve combination of the optical and SEM based approaches to take advantage of the strengths of each system
  • Keywords
    automatic optical inspection; computer vision; image classification; integrated circuit testing; integrated circuit yield; production testing; E-test/inspection data overlay; SEM approach; automatic defect classification; baseline yield enhancement; classification accuracy; data integrity; defect characterization rate; defect classification speed; high-resolution images; killer defects; optical approach; short loop process testers; yield learning rates; yield-limiting defects; Circuit testing; Costs; Fabrication; Inspection; Integrated circuit technology; Integrated circuit yield; Manufacturing processes; Production; Protection; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5217-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1999.798258
  • Filename
    798258