• DocumentCode
    3232624
  • Title

    Additive manufacturing of PZT-5H piezoceramic for ultrasound transducers

  • Author

    Singh, Prabhjot ; Smith, L. Scott ; Bezdecny, Michelle ; Cheverton, Mark ; Brewer, James A. ; Venkataramani, Venkat

  • Author_Institution
    GE Global Res., Niskayuna, NY, USA
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    1111
  • Lastpage
    1114
  • Abstract
    This paper describes the development of a low-cost, high speed manufacturing process method for the fabrication of piezoelectric ceramic transducer elements in the 1-25 MHz frequency range. A modified multi-layer lithography process, is used to additively manufacture high-resolution netshape ceramic structures by photopolymerizing a ceramic-polymer slurry using structured light patterns. The paper elaborates on the key considerations in the development of the process including the selection and optimization of slurry materials for the deposition of PZT 5H materials, optical exposure parameters, debinding/sintering profiles and post-manufacturing processing. coupling coefficient in the range of 0.52-0.54. Ongoing work includes improvements to materials properties, improved throughput and geometric fidelity.
  • Keywords
    ceramics; lithography; piezoceramics; polymerisation; polymers; sintering; slurries; ultrasonic transducers; PZT-5H piezoceramic transducer element; additive manufacturing; ceramic-polymer slurry; debinding profile; frequency 1 MHz to 25 MHz; geometric fidelity; manufacturing process method; materials property; multilayer lithography process; netshape ceramic structure; optical exposure parameter; photopolymerization; post-manufacturing processing; sintering profile; slurry material optimization; slurry material selection; structured light pattern; ultrasound transducer; Acoustics; Ceramics; Fabrication; Slurries; Transducers; Additive Manufacturing; Piezoelectricity; Ultrasound Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0273
  • Filename
    6293547