• DocumentCode
    3232632
  • Title

    Model to Hardware Matching; For nano-meter Scale Technologies

  • Author

    Nassif, Sani R.

  • Author_Institution
    IBM Res., Austin, TX
  • fYear
    2006
  • fDate
    6-8 Sept. 2006
  • Firstpage
    5
  • Lastpage
    8
  • Abstract
    Our ability to reliably predict the outcome of a semiconductor manufacturing process has been steadily deteriorating. This is happening because of two important factors. First, the overall CMOS technology slowdown has led to rapidly increasing complexity in the process and in its interaction with design. This has in turn caused an increase in the number and magnitude of systematic sources of mismatch between simulation models (both at the technology-CAD and at the circuit simulation levels) and hardware measurements. Second, manufacturing variability resulting from random as well as systematic phenomena -long a source of concern only for analog design- is becoming important for digital design as well and thus its prediction is now a first order priority. Process complexity and the challenges of accurately modeling variability have conspired to increase the error in performance predictions, leading to a gap in model to hardware matching. In this paper, we will review these issues and show examples of potential solutions to this problem some of which are currently being developed in IBM, and some which are longer term and would benefit greatly from the attention of the academic community
  • Keywords
    CMOS digital integrated circuits; circuit simulation; nanotechnology; semiconductor device manufacture; technology CAD (electronics); CMOS technology; IBM; circuit simulation; digital design; hardware matching; hardware measurements; manufacturing variability; nanometer scale technologies; process complexity; semiconductor manufacturing process; systematic mismatch sources; systematic phenomena; technology-CAD; CMOS technology; Circuit simulation; Hardware; Lithography; MOSFET circuits; Predictive models; Semiconductor device modeling; Shape; Solid modeling; Virtual manufacturing; component; manufacturing variations; model to hardware correlation; modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2006 International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    1-4244-0404-5
  • Type

    conf

  • DOI
    10.1109/SISPAD.2006.282826
  • Filename
    4061569