DocumentCode
3232649
Title
TCAD as an integral part of the semiconductor manufacturing environment
Author
Minixhofer, Rainer
Author_Institution
Austria Microsyst. AG, Unterpremstaetten
fYear
2006
fDate
6-8 Sept. 2006
Firstpage
9
Lastpage
16
Abstract
This work shows a new methodology which automates the necessary links between technology computer aided design (TCAD) and the semiconductor manufacturing environment to a high extent. Initially a short overview of a typical chain of processes during the fabrication of an integrated circuit is given. Furthermore an overview on the relations to the respective simulator tools is given. The interfaces between the fabrication process and simulation are identified and the detailed structure of the interfaces is outlined. A comprehensive overview over the interactions in this integrated system is given as well. Finally the strengths of such a structured and integrated approach are demonstrated with a case in a real semiconductor fabrication environment
Keywords
integrated circuit manufacture; integrated circuit modelling; interface phenomena; semiconductor device manufacture; semiconductor process modelling; technology CAD (electronics); TCAD; integrated circuit fabrication; interface structures; semiconductor manufacturing environment; simulator tools; technology computer aided design; Circuit simulation; Etching; Fabrication; Industrial electronics; Integrated circuit modeling; Integrated circuit technology; Lead compounds; Predictive models; Semiconductor device manufacture; Semiconductor process modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location
Monterey, CA
Print_ISBN
1-4244-0404-5
Type
conf
DOI
10.1109/SISPAD.2006.282827
Filename
4061570
Link To Document