• DocumentCode
    3232659
  • Title

    CMOS integrated cantilevers with sub-μm tips for thermal sensing

  • Author

    Chi-Pei Wu ; Hong-Da Dai ; Yang, S.S. ; Shi-Jie Hung

  • Author_Institution
    Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    164
  • Lastpage
    169
  • Abstract
    This work presents the CMOS micromachined dielectric cantilevers with integrated sharp tips for surface temperature measurement. The integrated cantilever can perform electrothermal actuation and piezoresistive sensing for maintaining a proper tip-sample contact. For the cantilever of 280-mum long, the measured thermoelectric power from the aluminum/polysilicon thermocouple is 22.6plusmn0.36 muV/degC, the measured time constant is 796 mus, and the drift due to thermal actuation is 0.15plusmn0.057 muV/degC. The measured displacement by thermal actuation is 2.2 mum at 17.8 mW and the measured thermal time constant is 79.6 mus. The measured piezoresistive sensitivity and pre-amp noise are 0.48 mV/mum and 0.7 muV/Hz1/2, respectively, producing an equivalent input-referred noise displacement of 1.45 nm/Hz1/2.
  • Keywords
    CMOS integrated circuits; aluminium; cantilevers; micromechanical devices; piezoresistive devices; temperature measurement; thermocouples; CMOS integrated cantilevers; CMOS micromachined dielectric cantilevers; aluminum/polysilicon thermocouple; electrothermal actuation; piezoresistive sensing; piezoresistive sensitivity measurement; surface temperature measurement; thermal sensing; thermoelectric power measurement; Aluminum; Dielectric measurements; Displacement measurement; Electrothermal effects; Noise measurement; Piezoresistance; Power measurement; Temperature measurement; Thermoelectricity; Time measurement; CMOS; cantilever; piezoresistive; thermocouple; tip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484310
  • Filename
    4484310