DocumentCode :
3232659
Title :
CMOS integrated cantilevers with sub-μm tips for thermal sensing
Author :
Chi-Pei Wu ; Hong-Da Dai ; Yang, S.S. ; Shi-Jie Hung
Author_Institution :
Inst. of Electron. Eng., Nat. Tsing Hua Univ., Hsinchu
fYear :
2008
fDate :
6-9 Jan. 2008
Firstpage :
164
Lastpage :
169
Abstract :
This work presents the CMOS micromachined dielectric cantilevers with integrated sharp tips for surface temperature measurement. The integrated cantilever can perform electrothermal actuation and piezoresistive sensing for maintaining a proper tip-sample contact. For the cantilever of 280-mum long, the measured thermoelectric power from the aluminum/polysilicon thermocouple is 22.6plusmn0.36 muV/degC, the measured time constant is 796 mus, and the drift due to thermal actuation is 0.15plusmn0.057 muV/degC. The measured displacement by thermal actuation is 2.2 mum at 17.8 mW and the measured thermal time constant is 79.6 mus. The measured piezoresistive sensitivity and pre-amp noise are 0.48 mV/mum and 0.7 muV/Hz1/2, respectively, producing an equivalent input-referred noise displacement of 1.45 nm/Hz1/2.
Keywords :
CMOS integrated circuits; aluminium; cantilevers; micromechanical devices; piezoresistive devices; temperature measurement; thermocouples; CMOS integrated cantilevers; CMOS micromachined dielectric cantilevers; aluminum/polysilicon thermocouple; electrothermal actuation; piezoresistive sensing; piezoresistive sensitivity measurement; surface temperature measurement; thermal sensing; thermoelectric power measurement; Aluminum; Dielectric measurements; Displacement measurement; Electrothermal effects; Noise measurement; Piezoresistance; Power measurement; Temperature measurement; Thermoelectricity; Time measurement; CMOS; cantilever; piezoresistive; thermocouple; tip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
Type :
conf
DOI :
10.1109/NEMS.2008.4484310
Filename :
4484310
Link To Document :
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