Title :
Two methods for improved accuracy calibration and control of ion implanter incidence angle
Author :
Elzer, R. Daniel ; Oakey, Paul ; Chen, Jiann-Jong ; Sing, David
Author_Institution :
Motorola Inc., Chandler, AZ, USA
Abstract :
Recent trends in semiconductor manufacturing require the use of higher energy ion implantation and tighter implant angle control. This paper describes the use of SIMS profiles and ThermaWave ThermaProbe maps to determine the accuracy of ion implanter tilt and twist orientation
Keywords :
angular measurement; calibration; ion implantation; photothermal effects; process control; secondary ion mass spectroscopy; spatial variables control; SIMS profiles; ThermaWave ThermaProbe maps; batch implanters; calibration; improved accuracy; incidence angle control; ion implanter incidence angle; semiconductor manufacturing; tilt orientation; twist orientation; Application specific integrated circuits; Atomic measurements; Calibration; Implants; Ion implantation; Mass spectroscopy; Nuclear electronics; Semiconductor device manufacture; Shadow mapping; Silicon;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5217-3
DOI :
10.1109/ASMC.1999.798262
