DocumentCode
3232798
Title
Alignment optimization and residual analysis for critical DUV photolithography
Author
Putnam, Chris ; Tyminski, Jacek K. ; Batterson, R. ; Gallo, A.
Author_Institution
Nikon Precison Inc, Manassas, VA, USA
fYear
1999
fDate
1999
Firstpage
378
Lastpage
387
Abstract
This work examines the alignment residual data for photolithography imaging in relationship to the maximum-minimum measured overlay values with linear factors corrected. Within the scope of this work, the relationships of maximum and minimum overlay vectors are examined instead of a three-sigma value characterizing the overlay. (The maximum vector is very close to a three sigma number, and the effective analysis would not be very different if three-sigma metric had been considered.) Such evaluation can lead to the understanding of what levels of alignment residuals are required to meet corresponding overlay budgets. It can be used to choose the alignment strategy or as a filter of real-time production alignment data
Keywords
ultraviolet lithography; DUV photolithography; IC manufacturing; overlay vector; residual analysis; wafer alignment optimization; Data engineering; Filtering; Filters; Lithography; Manufacturing processes; Production; Sampling methods; Semiconductor device manufacture; Semiconductor device modeling; Vectors;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5217-3
Type
conf
DOI
10.1109/ASMC.1999.798269
Filename
798269
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