• DocumentCode
    3232798
  • Title

    Alignment optimization and residual analysis for critical DUV photolithography

  • Author

    Putnam, Chris ; Tyminski, Jacek K. ; Batterson, R. ; Gallo, A.

  • Author_Institution
    Nikon Precison Inc, Manassas, VA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    378
  • Lastpage
    387
  • Abstract
    This work examines the alignment residual data for photolithography imaging in relationship to the maximum-minimum measured overlay values with linear factors corrected. Within the scope of this work, the relationships of maximum and minimum overlay vectors are examined instead of a three-sigma value characterizing the overlay. (The maximum vector is very close to a three sigma number, and the effective analysis would not be very different if three-sigma metric had been considered.) Such evaluation can lead to the understanding of what levels of alignment residuals are required to meet corresponding overlay budgets. It can be used to choose the alignment strategy or as a filter of real-time production alignment data
  • Keywords
    ultraviolet lithography; DUV photolithography; IC manufacturing; overlay vector; residual analysis; wafer alignment optimization; Data engineering; Filtering; Filters; Lithography; Manufacturing processes; Production; Sampling methods; Semiconductor device manufacture; Semiconductor device modeling; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5217-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1999.798269
  • Filename
    798269