Title :
Design of a thermally driven resonant miniature electric field sensor with feedback control
Author :
Chen, Xianxiang ; Peng, Chunrong ; Xia, Shanhong
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing
Abstract :
A thermally driven resonant miniature electric field sensor (MEFS) with feedback control has been designed. It is mainly comprised of grounded shielding electrodes, bent beam thermal driver, positive and negative sensing electrodes and driving displacement amplitude control unit etc, the shielding electrodes are driven by a cascaded bent beam thermal driver to periodically cover or expose the positive and negative sensing electrodes under them, the driving displacement feedback control unit is used to maintain the displacement amplitude of the shielding electrodes. The thermally driven resonant MEFS has the advantage of small size, light weight, low driving voltage, low drive detection cross talk noise etc. The driving displacement amplitude feedback control unit can dramatically decrease the influence of temperature change on the vibration displacement of the shielding electrodes. When activated with a square wave of plusmn2 V amplitude at a frequency of 20 kHz, the electric field intensity resolution of the thermally driven resonant MEFS without feedback control can reach 101.7 V/m.
Keywords :
displacement control; electric sensing devices; electromagnetic shielding; feedback; microsensors; amplitude square wave; cascaded bent beam thermal driver; cross talk noise detection; displacement feedback control; driving displacement amplitude control unit; electric field intensity resolution; frequency 20 kHz; grounded shielding electrodes; thermally driven resonant miniature electric field sensor; Driver circuits; Electric fields; Electrodes; Electrostatics; Feedback control; Micromechanical devices; Milling machines; Resonance; Thermal force; Thermal sensors; MEMS; electric field sensor; feedback control; resonant; thermal driver;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
Conference_Location :
Sanya
Print_ISBN :
978-1-4244-1907-4
Electronic_ISBN :
978-1-4244-1908-1
DOI :
10.1109/NEMS.2008.4484329