Title :
Investigation of SNM with Random Dopant Fluctuations for FD SGSOI and FinFET 6T SOI SRAM Cell by Three-dimensional Device Simulation
Author :
Tanabe, R. ; Ashizawa, Y. ; Oka, H.
Author_Institution :
Fujitsu Labs. Ltd., Tokyo
Abstract :
As CMOS technology is dramatically scaled down in recent years, the operation of SRAM becomes one of critical issues for further scaling. In this paper, we have focused on both FD SGSOI and DG (FinFET) devices because of the scaling capabilities, and we have simulated SRAM SNM with discrete dopant fluctuations in the channel regions by 3D simulation. As for SNM, FinFET is a promising candidate up to 32 nm node, but for 22 nm node, it will be difficult to operate even a FinFET with stability. As for fluctuations, the total number of dopant in channel depletion layer is a key factor. The fluctuations of SNM in FinFET are reduced by balancing fin thickness and dopant density in the channel
Keywords :
CMOS memory circuits; MOSFET; SRAM chips; fluctuations; integrated circuit modelling; integrated circuit noise; semiconductor doping; silicon-on-insulator; technology CAD (electronics); CMOS technology; FD SGSOI; FinFET 6T SOI SRAM cell; SNM; TCAD; channel depletion layer; dopant density; random dopant fluctuations; static noise margin; three-dimensional device simulation; Boron; CMOS technology; Circuit simulation; Computational modeling; Databases; FinFETs; Fluctuations; MOS devices; Poisson equations; Random access memory; 3D simulation; FDSOI; FinFET; SRAM; Static Noise Margin; TCAD; component; fluctuation; scaling;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0404-5
DOI :
10.1109/SISPAD.2006.282848