Ablative material removal utilizing the copper vapor laser

Author

Warner, Bruce E. ; Boley, Charles D. ; Chang, Jim J. ; Dragon, Emest P. ; Havstad, Mark A. ; Martinez, Mark ; McLean, William, II

Author_Institution

Lawrence Livermore Nat. Lab., CA, USA

Volume

1

fYear

1995

fDate

30-31 Oct 1995

Firstpage

306

Abstract

Summary form only given. Laser drilling has been widely used in industry because of its high production rate, ability to rapidly vary hole size, ability to drill holes at shallow angles, and ability to drill traditionally hard to work materials such as ceramics and composite materials. We have extended this utility to sub-millimeter dimensions by use of a near diffraction limited copper laser and precision wave front tilting technology

Keywords

copper; gas lasers; laser ablation; laser beam machining; laser mirrors; optical scanners; Cu; Cu vapour laser; Laser drilling; ablative material removal; ceramics; composite materials; copper vapor laser; drill holes; high production rate; industry; near diffraction limited copper laser; precision wave front tilting technology; rapidly vary hole size; shallow angles; sub-millimeter dimensions; Chemical lasers; Copper; Displays; Laser applications; Laser modes; Materials processing; Optical materials; Optical pulses; Pulsed laser deposition; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-2450-1

Type

conf

DOI

10.1109/LEOS.1995.484882

Filename

484882