DocumentCode :
3233158
Title :
Stress Sensitivity of PMOSFET Under High Mechanical Stress
Author :
Tekleab, D. ; Adams, V. ; Loiko, K. ; Winstead, B. ; Parsons, S. ; Grudowski, P. ; Foisy, M.
Author_Institution :
Austin Silicon Technol. Solutions, Freescale Semicond. Inc., Austin, TX
fYear :
2006
fDate :
6-8 Sept. 2006
Firstpage :
119
Lastpage :
122
Abstract :
Using PMOSFETs with a range of built-in process induced stress and four-point bending characterization, we present evidence that the stress response of PMOSFETs increases with channel stress. A novel method incorporating the characterization data with channel stress simulation has been developed which shows excellent agreement between our prediction and measured transistor performance data for nitride etch stop layer splits. Our analysis indicates that PMOSFETs will continue to show increasingly effective performance enhancement at higher channel stress
Keywords :
MOSFET; semiconductor device models; stress effects; PMOSFET; built-in process induced stress characterization; channel stress simulation; four-point bending characterization; measured transistor performance; mechanical stress; nitride etch stop layer splits; stress response modeling; stress sensitivity; Compressive stress; Etching; MOSFET circuits; Performance analysis; Piezoresistive devices; Predictive models; Silicon; Stress measurement; Tensile stress; Transistors; four-point bending; high mechanical stress; modeling stress response; stress sensitivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2006 International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0404-5
Type :
conf
DOI :
10.1109/SISPAD.2006.282852
Filename :
4061595
Link To Document :
بازگشت