• DocumentCode
    3233167
  • Title

    Design and implementation of wafer transporting system for photo lithographer

  • Author

    Wang, Kai ; Song, Yixu ; Yang, Zehong ; Zhao, Yannan ; Wang, Jiaxin

  • Author_Institution
    State Key Lab. of Intell. Technol. & Syst., Tsinghua Univ., Beijing
  • fYear
    2008
  • fDate
    6-9 Jan. 2008
  • Firstpage
    305
  • Lastpage
    310
  • Abstract
    Wafer transporting system is a vital part of IC manufacturing system. This paper presents the design and implementation of the wafer transporting system. Approaches in pre-aligning process and re-locating process are important to the performance of the system. In pre-aligning, Least Square Circle Fitting is adopted to locate the center of the wafer and the notch of the wafer. In re-locating, Section Linear Interpolation is used to calibrate the sensor and special locations of sensors are applied to calculate the wafer eccentricity relative to the fiducially position. The precision of the whole system is very high.
  • Keywords
    photolithography; semiconductor device manufacture; least square circle fitting; photolithography; pre aligning process; re locating process; wafer transporting system; Charge coupled devices; Design engineering; Fitting; Least squares methods; Manufacturing systems; Mechanical sensors; Optical arrays; Optical devices; Optical sensors; Sensor arrays; IC Manufacturing Equipment; Wafer Pre-align Square Fitting Approach; Wafer Transport;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008. 3rd IEEE International Conference on
  • Conference_Location
    Sanya
  • Print_ISBN
    978-1-4244-1907-4
  • Electronic_ISBN
    978-1-4244-1908-1
  • Type

    conf

  • DOI
    10.1109/NEMS.2008.4484340
  • Filename
    4484340