Title :
Synchronization and power integrity issues in 3-D ICs
Author :
Pavlidis, Vasilis F. ; Xu, Hu ; Tsioutsios, Ioannis ; De Micheli, Giovanni
Author_Institution :
Integrated Syst. Lab., EPFL, Lausanne, Switzerland
Abstract :
Several challenges should be resolved for three-dimensional integration to evolve to a mainstream technology. Among these challenges, the issues of synchronization and power integrity become predominant due to the multiple planes and the heterogeneity of 3-D circuits. The paper offers an overview of the state of the art research related to these global in nature issues. Experimental results, design techniques, and models are discussed highlighting the possible means and requirements for the design of reliable synchronization and power distribution schemes in 3-D circuits.
Keywords :
integrated circuit design; integrated circuit modelling; power distribution; synchronisation; three-dimensional integrated circuits; 3D IC; power distribution; power integrity; synchronization; three-dimensional integration; Clocks; Integrated circuit interconnections; Integrated circuit modeling; Network topology; Synchronization; Three dimensional displays; Topology; 3-D integration; clock distribution networks; power distribution networks; synchronization;
Conference_Titel :
Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-7454-7
DOI :
10.1109/APCCAS.2010.5775082
